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Development of an apparatus for measuring adhesive force between fine particles

  • At: 2004 FIP Congress in New Orleans (USA)
  • Type: Poster
  • By: SHIMADA, YASUHIRO (Okada Seiko Co., Ltd., R&D Division, Tokyo, Japan)
  • Co-author(s): Nonaka (Okada Seiko Co., Ltd., TOKYO, Japan)
    Katou (Okada Seiko Co., Ltd., TOKYO, Japan)
    Sunada (Meijo University, Japan)
    Yonezawa (Meijo University, Japan)
  • Abstract:

    We developed a new apparatus to measure the adhesive force between particles with a high resolution of approximately 2 nN. The force was measured directly by applying a pulling force to the particles with a contact needle. In addition, the separation process was observed with a 3CCD camera during the measurement. The adhesive force of six kinds of ..

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Last update 4 October 2019

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